Wednesday, 20 August 2008. 14:57 GMT
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Hynix demonstrates DDR3 R-DIMM using MetaRAM technology at IDF
Posted by Winston Chim   on Wednesday, 20 August 2008. 11:02 GMT

Digitimes

"At the ongoing Intel Developer Forum (IDF) (August 19-21) in San Francisco, Hynix Semiconductor announced that it is using MetaRAM's new DDR3 technology in its next generation R-DIMMs, including the world's first 16GB 2-rank DIMM (HMT32GR7AER4C-GD. The new 16GB and 8GB (HMT31GR7AER4C-GC) 2-rank DIMMs can triple DDR3 memory capacity in servers and workstations, enabling the world's highest memory capacity per channel without degrading performance, the company noted.

Intel will demonstrate the world's first 16GB 2-rank DIMM from Hynix, using the MetaRAM DDR3 chipset at IDF. Intel will also demonstrate a server with 160GB using Hynix DDR3 R-DIMMs and Meta SDRAM technology, Hynix said.

DDR3 MetaRAM is similar to the previous generations of DDR2 technology that enable significantly more memory in a server. An added benefit of the DDR3 MetaRAM technology is that enables larger memory capacity without negatively impacting the operating frequency of the DDR3 memory channel. It is the only technology that has been demonstrated to run 24GB of DDR3 SDRAM in a channel at 1066 million transactions per-second (MT/s). Using 3 of 16GB DIMM, users can achieve 48GB per channel running at 1066 MT/s, while other competing solutions max out at 16GB per channel at 1066MT/s.

Along with its earlier DDR2 technology, the DDR3 MetaRAM technology enables Hynix to introduce cost-effective, high capacity R-DIMMs by using mainstream 1Gb DRAMs."

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Intel details new core chip line
Posted by Winston Chim   on Wednesday, 20 August 2008. 10:58 GMT

BBC

"Intel has unveiled the processors that will form the core of its product line from 2009 onwards. Details about Nehalem, now officially called Core i7, were given at the Intel Developers Forum in San Francisco. The chips will appear in laptops, desktops and servers and with them Intel aims to boost processing ability, cut power use and improve graphics.

"Nehalem will be the backbone of Intel for years to come," said Intel fellow Rajesh Kumar. "It provides the best of both worlds," he said. "Higher performance and energy efficiency are not mutually exclusive if you innovate enough."

With Nehalem Intel has combined memory and processing functions into a single chip instead of using two. On the most powerful Core i7 processors this will result in as many as eight processing cores co-existing on a single chip.

Intel claims the innovations on the family of products will offer three times the memory bandwidth of the previous generation of chips and twice the performance of 3-D animation.

Nehalem is also able to ramp down its power demands thanks to a "turbo mode" that turns off parts of the chip that are not being used. Intel also said the Nehalem design boosts the speed at which data can be shunted from memory in the computer to the microprocessor. "

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Radeon HD 4600 series cards detailed
Posted by Pieter Bettens   on Tuesday, 19 August 2008. 20:43 GMT

I recently told about the Radeon HD 4670, now there are also details of the 4650 and an expected release date of September 10th.

TechConnect

"With the mid-range and high-end zones pretty much covered with the Radeon HD 4800 cards AMD is preparing to release a few new, lower end products too. The Radeon HD 4600 series, which consists of the Radeon HD 4650 and 4670 cards, makes use of the 55nm RV730 chip which offers DirectX 10.1 and CrossFireX support, a 128-bit memory interface, UVD 2 and, last but not least, 320 Stream Processors.

The Radeon HD 4670 will be available with either 512MB of memory clocked at 1000 MHz (2000 MHz DDR) or 1GB set to 873 MHz and a 750 MHz core, will make use of a single-slot cooling solution and won't require additional power apart from that provided by the PCIe slot.

The Radeon HD 4650 will feature a GPU clock of 600 MHz and 512MB of GDDR2/3 memory @ 500 MHz but another SKU, with GDDR3 memory clocked at 667 MHz is apparently also in the works.

AMD is expected to officially introduce the Radeon HD 4600 series on September 10."

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Archos Media Tablets announced
Posted by Pieter Bettens   on Tuesday, 19 August 2008. 20:29 GMT

Archos, a French brand who might not be known by many, is a manufacturer of quality Portable Media Players and since today also of Internet Media Tablets with the new Archos 5, 5G and 7.

 

Archos 5, 5G and 7

 

Engadget

"So Archos still seems to be struggling a bit matching the design curve of the industry, but boy oh boy can they pile on those specs. The new Archos 5 and Archos 7 "generation 6" players offer capacities as high as 320GB, well-res'd screens and just about every codec we'd ever need -- plus available plug-ins to cover the rest. But that's not even the exciting part. The Archos 5g adds in that 3.5 HSDPA data we were hearing about, providing true on-the-go surfing, and all three players sport WiFi as well. Sizes start off at 30GB for the Archos 5g, which runs a 800 x 480 4.8-inch touchscreen. The Archos 5 bumps that up to 60-250GB, while the Archos 7 does up 160GB and 320GB, with a 7-inch touchscreen that sadly matches the 5 series' resolution exactly. All three players can record VGA video through an optional DVR Station dock or the DVR snap-on accessory, and Archos will have plenty of other accessories in the offing as well. As for player design, Archos has made considerable strides in thinness, with the Archos 7 at 0.63-inches thick, and the Archos 5 as slim as 0.5-inches, depending on drive size, but we're not crazy about the new look -- though we're sure opinions will vary."

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More details and prices on these can be found at the Archos website.

Some exclusive footage and articles on these new devices can be found at Archoslounge.

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GC 2008: Many new games
Posted by Mark Hazlewood   on Tuesday, 19 August 2008. 17:06 GMT

Hardware-Infos

"In three days the games Convention starts. Many publisher have said that they want to announce many games at this festival. So, if you visit the fair, you can expect to play: C&C: Alarmstufe Rot 3, Crysis Warhead, Dead Space, Die Sims 3, Left 4 Dead (EA), Far Cry 2, Prince of Persia, Tom Clancy's Endwar, Tom Clancy's H.A.W.X (Ubisoft), Stalker: Clear Sky (Deep Silver), Tom-Raider: Underworld (Eidos), Bionic Commando, Dark Void, MotoGP 08, Street Fighter IV (Capcom), TR Evolution, Legendary (Atari) and Call of Duty 5: World at war (Activision)"

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OCZ unveil the ModXStream Pro power supply line-up
Posted by Mark Hazlewood   on Tuesday, 19 August 2008. 17:03 GMT

TC Magazine

"The O to the Z Technology Group known simply as OCZ has now introduced a new series of power supplies, the ModXStream Pro. Claimed to be gaming-grade units, the ModXStream Pro power supplies are modular, have ATX12V v2.2 and EPS12V certification and come in 400, 500, 600 and 700W configurations. The new PSUs measure 150 (W) x 165 (L) x 86 (H) mm, have overvoltage, overcurrent and short-circuit protection, an efficiency of 82% at typical load and a passion for juicing up SLI and CrossFire setups.

Offering two 12V rails, OCZ's ModXStream Pro units are cooled off by either a 140mm (400W model) or a 120mm (500, 600 and 700W) fan and they are all backed up by a 3-year warranty.

"Global market presence for OCZ high-performance power supplies continues to grow rapidly due to our ability to remain on the cutting-edge of both efficiency and stability," said Ryan Edwards, Director of Product Management. "With the introduction of the ModXStream Pro line of PSUs, end-users can have the whole package - efficiency, stability, low noise, clean high-performance power, and the increased air flow and convenience of modular cables. With a power output to fit every need, the 400 – 700W MXSP are an exciting addition to the extensive range of PSUs offered by the OCZ Technology Group."

For now, there's no word on pricing but all should be revealed as soon as the ModXStream Pro PSUs hit the stores."

 

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New Hypertransport specification reveals updates for AMD's 45 nm CPUs, Fusion secret
Posted by Mark Hazlewood   on Tuesday, 19 August 2008. 16:59 GMT

VR-Zone Forums

"As the release of AMD's 45 nm processors Shanghai and, more importantly, Deneb is drawing closer, we are getting a better idea of what to expect from AMD’s next generation of CPUs. The HyperTransport Consortium just released details of the HyperTransport 3.1 specification, which increases the clock speed from 2.6 to 3.2 GHz (6.4 GTransfers/s).

Since the HyperTransport (HT) bus is 32-bit wide, the total aggregate bandwidth grows to a massive 51.6 GB/s (25.8 GB/s in both directions), which is a 10 GB/s improvement over the original 3.0 standard and a powerful tool to improve the performance of HT components such as chipsets and CPUs – including the upcoming Fusion processor.

It is widely expected that motherboard vendors will have no trouble adopting 3.1 support in 3.0-enabled chipsets. AMD’s existing 790FX and GX chipsets should support native bandwidth of HT 3.1 as soon as you pair them with a 45 nm CPU.

The HyperTransport Consortium also revealed the HTX3 specification, lifting the potential aggregate bandwidth of HTX cards to the level of HT3.1: 51.6 GB/s is an impressive number for an extension connector and we are hearing that the standard is already getting some attention in the field of enterprise NAS-boxes with SSD technology.

Possibly most interesting, HT3.1 and HTX3 clear up some of the questions surrounding key features of AMD’s Fusion processor. Without doubt, HyperTransport 3.1 will be used as a communication interface between CPU and GPU and a bandwidth of 51.6 GB/s may open a whole new world of possibilities and an opportunity to be more competitive with Intel in terms of overall performance.

HyperTransport 3.1 will also be included with every Shanghai processor. According to our sources however, the technology will disabled and only HyperTransport 1.1 and 2.0 (up to 22.4 GB/s) will be supported."

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Micron memory card partners settled
Posted by Mark Hazlewood   on Tuesday, 19 August 2008. 16:56 GMT

Digitimes

"Micron Technology has made further progress on its memory card deployment by settling controller IC and backend production partners. Industry sources noted that InComm and Siliconware Precision Industries Ltd. (SPIL) are the respective partners for Micron, and a secondary controller IC house may likely be added in the future.

By extending its presence from upstream memory chips to downstream finished card production, Micron will be the fourth memory maker after Samsung Electronics, Toshiba and Hynix Semiconductor, that has tapped into the memory card business, industry watchers noted. They commented that the move is logical, citing a supply glut that prompts players to seek alternatives to digest excess inventory.

The sources noted that InComm has been selected as Micron's memory card controller IC supplier. Competitors of InComm are aggressively soliciting potential orders from Micron also; therefore, more controller IC design houses may be selected in the future, they added.

Already being the packaging and testing partner for Micron on both DRAM and NAND flash, SPIL is said to have taken assembly orders for Micron memory cards also. The sources added that Micron has started placing wafer-level testing orders for DRAM and NAND flash at SPIL from the first quarter of 2008, marking a change of Micron's long-established in-house production strategy.

A consistent supply glut in the NAND flash industry has prompted fellow chipmakers to extend their presence beyond memory production, the industry watchers said. As these companies see weakening demand for memory chips, they have thus shifted to produce finished card and selling these cards in the "white-box" memory card market, or in some cases, to handset vendors.

Amid the change, those downstream memory module customers of the memory chipmakers have reduced their chip procurement amounts, as procurement costs for these finished cards is even lower. Part of their costs are saved from royalty payment to those associations (e.g.SecureDigital Association) for memory card standards as the responsibility of paying royalties will go to chipmakers themselves"

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CPU3D Review: Sapphire Radeon HD4870x2 (2Gb GDDR5)
Posted by Winston Chim   on Monday, 18 August 2008. 17:57 GMT

CPU3D Review: Sapphire Radeon HD4870x2 (2Gb GDDR5)

High resolution gaming is what hardcore enthusiasts love to do. So sahpphire has come up with the Radeon HD4870x2. The card features dual R700 GPUs @ 750Mhz and a massive 2Gb of GDDR5 ram. Based on advanced 55nm technology, it also include support for DX10.1, a massive 1600 stream processors and CrossfireX. This card is great news for enthusiast gamers who's after performance that's affordable.

 

 Sapphire Radeon HD4870x2            Sapphire Radeon HD4870x2 

 

" ... The Sapphire Radeon HD4870x2 is one of those cards that just oozes with appeal ... I can't really see why any hardcore gaming enthusiast would ignore it. It has everything going for it ... features, price and performance.  "  

Read the rest of the review ... HERE.

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Lenovo Announces ThinkPad X301 Notebook
Posted by Mark Hazlewood   on Monday, 18 August 2008. 15:03 GMT

DailyTech

"When Apple launched its MacBook Air 13.3” ultra-portable notebook earlier this year, it took the computing world by storm. The notebook didn’t impress people with high-end specifications or an overabundance of features or connectivity options – most were dazzled by the notebook’s sleek aluminum design/construction and slim profile.

Unbeknownst to most people, Lenovo was working on its own thin, lightweight ultra-portable of its own which it was aiming at the business sector (and comically at Apple’s MacBook Air). The Lenovo ThinkPad X300 launched in mid-February with a 1.2GHz Core 2 Duo processor, 13.3” LED-backlit display, 64GB solid state drive (SSD), optional built-in optical drive, and optional WWAN.

Lenovo is now ready to give its ThinkPad X300 a makeover in the form of the new ThinkPad 301. While the original ThinkPad X300 featured an ULV 1.2GHz Intel Core 2 Duo SL7100 processor, the new ThinkPad X301 will come equipped with either an ULV Intel Core 2 Duo U9300 (1.2GHz) or U9400 (1.4GHz) processor. Lenovo is also adding support for DDR3 memory.

The 64GB SSD remains standard equipment for storage duties, but an optional 128GB SSD is now on the options sheet for those that require more space. The ThinkPad X301 also supports DisplayPort and models coming later this year will also take advantage of WiMAX.

"Lenovo continues to push the technology envelope by giving road warriors the latest enhancements in solid state drive storage and digital display technologies with the new ThinkPad X301 notebook PC," said Sam Dusi, vice president, worldwide notebook product marketing for Lenovo. "This announcement extends our commitment to blending ultraportability and functionality, and equipping today’s business users with the most advanced, highest-performing computing tools."

The Lenovo ThinkPad X301 will start at $2,599 when it launches on August 26."

 


 

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Nvidia Interview: "We will regain performance crown this year"
Posted by Mark Hazlewood   on Monday, 18 August 2008. 14:59 GMT

Hexus

"The two people we speak to are Nick Stam (pictured), the technical marketing director for GeForce and Bryan Del Rizzo, PR manager in the US. We start by asking them what they feel about losing the performance leadership. Is that interesting?" says Del Rizzo. "To some people maybe, but it took two of their GPUs to beat one of ours. We have had dual GPU cards and it's feasible that it may happen again."
That last point was intriguing. In our review of the 4870 X2, HEXUS.net editor Tarinder Sandhu said: "We'll have to wait for the GTX 200-series to go on a process diet, to 55nm, and then, just perhaps, we'll see a GX2 based on GeForce GTX 260. While we're unable to draw either of them on whether or not this will happen, when we ask them if they expect to regain the performance leadership this year, Stam says "Yes".

That's as much as you're going to get on that topic for now and we move swiftly back to the 4870 X2. "Is that product the best product you can buy for a PC?" asks Del Rizzo. "A lot of people care about power consumption. Two GTX 260s have lower power consumption than one 4870 X2. In the Asia-Pacific region, for example, they're sensitive about power consumption. Stam is keen to point out that he thinks NVIDIA's multi GPU platform has advantages over AMD's. "We've done our own testing of SLI vs Crossfire and we see a lot of issues with Crossfire. SLI is far more developed and doesn't have as many issues."

Just be listening for more information around Nvision."

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