London, UK -- November 12, 2008 -- Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping select DDR3 and DDR2 HyperX memory modules with new T1 heatspreaders. The taller heatspreaders utilise HyperX Thermal Xchange (HTX) technology to further diffuse heat buildup when overclocking. HTX technology is the latest innovation from Kingston’s engineers who are dedicated to building the fastest memory for enthusiasts and gamers who push system performance.

“The HyperX T1 Series heatspreaders are made of heavy-duty extruded aluminum with extended fins and HTX technology for maximum thermal conditions when users take their systems to the extreme,” said Marc Bernier, European Research and Development Engineer, Kingston Technology, Kingston Technology. “Kingston’s T1 series is a great complement to our existing line of HyperX modules with the lower profile heatsink.”

Leading with HyperX DDR3 kits designed specifically for Intel’s new triple-channel Core i7 Processor in 2GHz, 1866- and 1800MHz frequencies, Kingston’s new HyperX T1 series modules are also available in DDR2 1066- and 800MHz front side bus speeds.