OCZ DDR2 PC2-8500 / 1066MHz / NVIDIA® SLI™-Ready Edition

	1066MHz DDR2
	EPP 5-5-5-15  (CAS-TRCD-TRP-TRAS)
	Available in 1GB (1024MB) modules
	Also available in a 2GB (2x1024) dual channel kit
	Unbuffered
	SLI-Ready XTC Heatspreader*
	Lifetime Warranty
	2.3 Volts
	240 Pin DIMM Special Features
	NVIDIA® SLI™ certified
	2.35V EVP** Part Numbers 1GB Module P/N – OCZ2N1066SR1G

New OCZ PC2-8500 Memory Modules are NVIDIA nForce SLI Certified resulting in better performance with select NVIDIA nForce motherboards

The new OCZ PC2-8500 SLI-Ready Series is equipped with NVIDIA Enhanced Performance Profiles (EPP) to optimize the modules’ performance on nForce® SLI-based motherboards. OCZ exclusively engineered select high-performance modules with advanced SPD (Serial Presence Detect) settings to allow compatible motherboards to recognize and utilize the added information, ultimately increasing the performance potential of the entire platform.

OCZ SLI-Ready memory modules are programmed to boot at 1066MHz DDR2 with supremely fast timings of 5-5-5. Only motherboards equipped with the custom-designed BIOS, such as those designed for NVIDIA nForce SLI MCPs, can detect the optimized SPD profiles and ensure the memory functions under the best possible conditions. The exclusive OCZ SPD specifications take out the guesswork and provide enthusiasts and gamers with significant overclocked performance with no manual adjustment or compatibility issues.

Each OCZ SLI-Ready module comes equipped with an exclusive NVIDIA XTC heatspreaders for the most efficient heat dissipation and a look that stands out like its performance. Additionally, all SLI-Ready memory is backed with toll-free technical support, the exclusive EVP (Extended Voltage Protection) coverage, and an industry leading Lifetime Warranty.

With the fusion of the sophisticated EPP memory specification and cutting-edge, high-speed OCZ DDR2 architecture, the PC2-8500 edition is the ultimate breakthrough for advanced SLI platform performance.

* XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.

**OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 2.35V without invalidating their OCZ Lifetime Warranty.

More information can found on OCZ Techology's website.